하드 코트층 부가 몰드 수지 및 그의 제조 방법

• Main Authors: KITAJIMA YUTAKA, SUGIURA HISAYA, NAKAI RYOUICHI, IKEYA TAKAYUKI
• Format: Patent
• Language: Korean
• Published: 10.08.2021
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

기재 시트(2)와, 기재 시트(2)의 한쪽 면에 배치되고 봉지재(13)의 표면의 적어도 일부를 보호하기 위한 보호층(3)을 구비하는 다층 시트(1)를 구비하는 전사재(5)에 있어서, 보호층(3)은 다층 시트(1)의 최표층이고, 활성 에너지선 경화성 수지의 활성 에너지선에 의한 경화물 또는 반경화물을 포함하고, 몰드 원료(18) 및/또는 몰드 반경화물(19)과 열경화 반응할 수 있는 열반응성기와 폴리실록세인쇄를 갖는 전사재(5)를 준비하고 몰드 원료(18) 및/또는 몰드 반경화물(19)을 준비하고, 보호층(3)이 노출되도록 전사재(5)를 배치하고 몰드 원료(18) 및/또는 몰드 반경화물(19)과 보호층(3)을 접촉시켜 가열하여 봉지재(13)에 보호층(3)을 열경화시켜 이루어지는 하드 코트층(14)을 전사한다. A method of producing a hard coating layer-laminated mold resin comprising a transfer material preparation step, a resin preparation step, a disposition step, and a transfer step. In the transfer material preparation step, a transfer material including a substrate sheet and a protective layer is prepared. The protective layer includes a cured and/or half-cured product of an active energy ray-curable resin and has a thermally reactive group and a polysiloxane chain. In the resin preparation step, mold resin in a thermally uncured and/or half-cured state is prepared. In the disposition step, the transfer material is disposed so that the protective layer is exposed. In the transfer step, the mold resin and the protective layer are brought into contact and heated to chemically bond them, and the mold layer is cured, and the protective layer is cured to form the hard coating layer.