MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

One embodiment of the present invention provides a multi-layer ceramic electronic component which comprises: a ceramic body including fifth and sixth surfaces facing a first direction, third and fourth surfaces facing a second direction, and first and second surfaces facing a third direction and con...

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Main Authors KANG YEON SONG, LEE JONG HO, KIM BUM SOO, CHUN DUK HYUN, PARK JIN SOO, PARK MYUNG JUN, GU HYUN HEE
Format Patent
LanguageEnglish
Korean
Published 19.07.2021
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Summary:One embodiment of the present invention provides a multi-layer ceramic electronic component which comprises: a ceramic body including fifth and sixth surfaces facing a first direction, third and fourth surfaces facing a second direction, and first and second surfaces facing a third direction and containing a capacity formation unit disposed to stack a dielectric layer and first and second internal electrodes between which the dielectric layer is sandwiched in the third direction; a first external electrode connected to the first internal electrode to have a first conductive layer and a first band portion; and a second external electrode connected to the second internal electrode to have a second conductive layer and a second band portion, wherein when the greatest thickness of the first and second conductive layers is referred to as Tc and the greatest thickness of the first and second band portions is referred to as Tb, Tb/Tc is no less than 0.85. Accordingly, a break in an external electrode can be prevented. 본 발명의 일 실시예는 제1 방향으로 대향하는 제5 및 제6 면, 제2 방향으로 대향하는 제3 및 제4 면, 제3 방향으로 대향하는 제1 및 제2 면을 포함하고, 유전체층 및 상기 유전체층을 사이에 두고 제1 및 제2 내부 전극이 제3 방향으로 적층되도록 배치되는 용량 형성부를 포함하는 세라믹 바디; 상기 제1 내부 전극과 연결되며, 제1 도전층 및 제1 밴드부를 포함하는 제1 외부 전극; 및 상기 제2 내부 전극과 연결되며, 제2 도전층 및 제2 밴드부를 포함하는 제2 외부 전극;을 포함하며, 상기 제1 및 제2 도전층의 최대 두께를 Tc라 하고, 제1 및 제2 밴드부의 최대 두께를 Tb라 할 때, Tb/Tc는 0.85 이상인 적층 세라믹 전자부품을 제공할 수 있다.
Bibliography:Application Number: KR20200002913