SEMICONDUCTOR PACKAGE

• Main Authors: CHOI JAEWON, KIM SUNG BUM, KANG TAEWOO
• Format: Patent
• Language: English; Korean
• Published: 24.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a semiconductor package which comprises: a lower package including a first substrate, a first semiconductor chip mounted on the first substrate, and a first molding unit covering the first semiconductor chip on the first substrate; an interposer substrate stacked on the first semiconduct...