SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

According to an embodiment of the present invention, provided is a semiconductor package, which comprises: a redistribution substrate having first and second surfaces located opposite each other, and including an insulating member and a plurality of redistribution layers disposed at a plurality of d...

Full description

Saved in:
Bibliographic Details
Main Authors CHAE SEUNG HUN, LEE JAE EAN, JO HYE YEONG, SEO IL JONG, MOON SO YEON, SEO YOUNG KWAN
Format Patent
LanguageEnglish
Korean
Published 21.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first