SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

The present invention relates to a substrate having an electronic component embedded therein, capable of reducing the processing slope of a cavity wall for embedding the electronic component. The present disclosure relates to a substrate having an electronic component embedded therein, which include...

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Bibliographic Details
Main Authors LEE YONG DUK, BYUN DAE JUNG, JEONG SANG HO, HWANG MI SUN, JO DAE HUI, PARK JE SANG, PARK CHANG HWA
Format Patent
LanguageEnglish
Korean
Published 21.06.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present invention relates to a substrate having an electronic component embedded therein, capable of reducing the processing slope of a cavity wall for embedding the electronic component. The present disclosure relates to a substrate having an electronic component embedded therein, which includes: a core structure including a first insulating body, and multiple core wiring layers disposed on the first insulating body or in the first insulating body, and having a cavity formed through a portion of the first insulating body toward a bottom surface, which is opposite to a top surface of the first insulating body, from the top surface of the first insulating body; an electronic part provided in the cavity; and a build-up structure including a second insulating body to cover at least a portion of each of the core structure and the electronic part while filled in at least a portion of the cavity, and at least one build-up wiring layer disposed on the second insulating body or in the second insulting body. A stopper layer is disposed on the bottom surface of the cavity, and a barrier layer is disposed on the first insulating body or inside the first insulating body such that an inner surface is exposed through the cavity. 본 개시는 제1절연바디, 및 상기 제1절연바디 상에 또는 내에 각각 배치된 복수 층의 코어 배선층을 포함하며, 상기 제1절연바디의 상면으로부터 반대측인 하면을 향하여 상기 제1절연바디의 일부를 관통하는 캐비티를 갖는 코어 구조체; 상기 캐비티 내에 배치된 전자부품; 및 상기 코어 구조체 및 상기 전자부품 각각의 적어도 일부를 덮으며 상기 캐비티의 적어도 일부를 채우는 제2절연바디, 및 상기 제2절연바디 상에 또는 내에 각각 배치된 한층 이상의 빌드업 배선층을 포함하는 빌드업 구조체; 을 포함하며, 상기 캐비티의 바닥면에는 스타퍼층이 배치되며, 상기 제1절연바디 상에 또는 내에는 상기 캐비티를 통하여 내측면이 노출되는 배리어층이 배치된, 전자부품 내장기판에 관한 것이다.
Bibliography:Application Number: KR20190164456