반도체용 접착제, 반도체 장치의 제조 방법 및 반도체 장치

(a) 무기 필러를 함유하고, 상기 (a) 무기 필러가, 글리시딜기를 갖는 표면 처리가 실시된 무기 필러를, 상기 (a) 무기 필러 전체량을 기준으로 하여 50질량% 이상 포함하는, 반도체용 접착제. An adhesive for semiconductors, which contains (a) an inorganic filler, and which is configured such that the inorganic filler (a) contains 50% by mass or more of a surface-treated inorgan...

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Bibliographic Details
Main Authors TANIGUCHI TETSUYA, CHABANA KOICHI, SATOU MAKOTO
Format Patent
LanguageKorean
Published 09.06.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:(a) 무기 필러를 함유하고, 상기 (a) 무기 필러가, 글리시딜기를 갖는 표면 처리가 실시된 무기 필러를, 상기 (a) 무기 필러 전체량을 기준으로 하여 50질량% 이상 포함하는, 반도체용 접착제. An adhesive for semiconductors, which contains (a) an inorganic filler, and which is configured such that the inorganic filler (a) contains 50% by mass or more of a surface-treated inorganic filler that has a glycidyl group based on the total amount of the inorganic filler (a).
Bibliography:Application Number: KR20217008276