수지 조성물, 프리프레그, 수지 부착 필름, 수지 부착 금속박, 금속 클래드 적층판, 및 프린트 배선판

• Main Authors: OTSUKA AKIRA, SHINPO TAKASHI, NAKAMURA YOSHIHIKO, FUJISAWA HIROYUKI, YAMAUCHI AKIHIRO
• Format: Patent
• Language: Korean
• Published: 31.05.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

수지 조성물은, 에폭시 수지와, 경화제와, 30000 이상 100000 이하의 범위 내의 중량 평균 분자량을 갖는 페녹시 수지와, 표면 조정제와, 소포제를 갖는다. 표면 조정제는, 폴리에터 변성 폴리다이메틸실록세인을 포함한다. 소포제는, 아크릴계 공중합체를 포함한다. This resin composition contains: an epoxy resin; a curing agent; a phenoxy resin having a weight average molecular weight in a range of 30,000-100,000; a surface conditioner; and a defoaming agent. The surface conditioner contains a polyether-modified polydimethylsiloxane. The defoaming agent contains an acrylic copolymer.