MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME USING APPLICATION SPECIFIC ELECTRONICS PACKAGING TECHNIQUES

• Main Authors: WILBURN RAND, FITZPATRICK RICHARD, ZADEREJ VICTOR, CHEONG E.H, DUNHAM DAVID
• Format: Patent
• Language: English; Korean
• Published: 24.05.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

디바이스, 커넥터/하우징 및 커버를 포함하는 마이크로 배전 박스가 제공된다. 디바이스는 기판, 제1 핑거, 제2 핑거 및 전기 구성요소를 갖는다. 제1 핑거는 제1, 제2 및 제3 부분들을 갖는다. 제2 핑거는 제1, 제2 및 제3 부분들을 갖는다. 기판은 제1 및 제2 핑거들의 제1 부분들에 오버몰딩된다. 기판은 제1 및 제2 핑거들의 제2 부분들에 또는 제1 및 제2 핑거의 제3 부분들에 오버몰딩되지 않는다. 제1 및 제2 핑거들의 제2 부분들은 기판으로부터 외향으로 연장된다. 제1 및 제2 핑거의 제3 부분들은 기판을 통해 제공되는 적어도 하나의 개구부를 통해 노출된다. 전기 구성요소는 전기 구성요소를 제1 및 제2 핑거 각각에 전기적으로 연결하기 위해 제1 및 제2 핑거의 제3 부분들에 직접 장착된다. 커넥터/하우징은 디바이스를 내부에 수납하도록 구성되고 정합 커넥터에 연결되도록 구성된다. 커버는 디바이스가 커넥터/하우징으로부터 제거되는 것을 방지하는 방식으로 커넥터/하우징에 고정되도록 구성된다. A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to electrically connect the at least one electrical component to the at least one first finger. The connector/housing is configured to house the device therein and is configured to be connected to a mating connector. The cover is configured to be secured to the connector/housing in a manner which prevents the device from being removed from the connector/housing.