SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

The present invention relates to a semiconductor memory device and a method of fabricating the same. The semiconductor memory device includes a lower electrode and an upper electrode facing each other with a dielectric film interposed therebetween, and a capacitor including an interface film between...

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Bibliographic Details
Main Authors AHN SEHYOUNG, KIM YOUNSOO, SONG JEONG GYU, PARK YOUNG LIM, JUNG KYOOHO, AN CHANGMU
Format Patent
LanguageEnglish
Korean
Published 12.05.2021
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Summary:The present invention relates to a semiconductor memory device and a method of fabricating the same. The semiconductor memory device includes a lower electrode and an upper electrode facing each other with a dielectric film interposed therebetween, and a capacitor including an interface film between the lower electrode and the dielectric film. The interface film includes a combination of niobium (Nb), titanium (Ti), oxygen (O), and nitrogen (N), and further includes a component of the dielectric film. An object of the present invention is to provide a semiconductor memory device with improved reliability. 본 발명은 반도체 메모리 소자 및 그의 제조 방법에 관한 것으로, 반도체 메모리 소자는 유전막을 사이에 두고 대향하는 하부전극과 상부전극, 그리고 상기 하부전극과 상기 유전막 사이의 계면막을 포함하는 커패시터를 포함한다. 상기 계면막은 네오븀(Nb), 타이타늄(Ti), 산소(O), 그리고 질소(N)의 조합을 포함하고, 그리고 상기 유전막의 구성 성분을 더 포함한다.
Bibliography:Application Number: KR20190138586