Punching method of sound absorbing panel hole and a sound absorbing panel using the same

• Main Author: CHO, YONG SUN
• Format: Patent
• Language: English; Korean
• Published: 10.05.2021
• Subjects: BUILDING; CEILINGS; FIXED CONSTRUCTIONS; FLOORS; GENERAL BUILDING CONSTRUCTIONS; INSULATION OR OTHER PROTECTION OF BUILDINGS; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; PERFORMING OPERATIONS; PUNCHING METAL; ROOFS; TRANSPORTING; WALLS, e.g. PARTITIONS; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL

The present invention relates to a punching method for manufacturing metal sound absorption panel where a plurality of holes are drilled, and a sound absorption panel manufactured by the punching method. The present invention comprises: a first step of fixating the sound absorption panel; a second step of closely attaching a cushion to a lower surface of the sound absorption panel; a third step of drilling the hole; and a fourth step of discharging a chip. The present invention can drill the holes in the sound absorption panel without genreation of burr. 본 발명은 다수의 홀이 타공된 금속 흡음 패널을 제조하기 위한 타공 방법 및 이 타공 방법으로 제조된 흡음 패널에 관한 것이다.