adhesive composition for encapsulating semiconductor and adhesive using the same

• Main Authors: KYUNG YOU JIN, JANG YOON SUN, JEONG MIN SU, LEE KWANG JOO
• Format: Patent
• Language: English; Korean
• Published: 03.05.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

The present invention relates to an adhesive composition for semiconductor encapsulation and an adhesive for semiconductor encapsulation using the same, and more specifically, to an adhesive composition for semiconductor encapsulation, which improves adhesion between a semiconductor chip and an adhesive for semiconductor encapsulation and improves durability, and an adhesive for semiconductor encapsulation using the same. According to an embodiment of the present invention, cracks are prevent by improving adhesion with semiconductor chips and inorganic fillers by including a silane coupling agent modified with a carboxylic acid terminal and shear strength at a high temperature can be improved. 본 발명은 반도체 봉지용 접착 조성물 및 이를 이용한 반도체 봉지용 접착제에 관한 것으로, 보다 구체적으로 반도체 칩과 반도체 봉지용 접착제 간에 접착력을 향상시키며, 내구성을 향상시키는 반도체 봉지용 접착 조성물 및 이를 이용한 반도체 봉지용 접착제에 관한 것이다. 본 발명의 일 실시예에 따르면, 말단이 카르복시산으로 개질된 실란 커플링제를 포함함으로써, 반도체 칩 및 무기필러와의 접착력을 향상시켜 크랙이 발생하는 것을 방지하며, 고온에서의 전단강도를 향상시킬 수 있다.