다이싱 필름 기재용 수지 조성물, 다이싱 필름 기재 및 다이싱 필름

• Main Authors: NAKANO SHIGENORI, TAKAOKA HIROKI, SAKUMA MASAMI
• Format: Patent
• Language: Korean
• Published: 16.03.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING-UP

높은 강도와 높은 열수축성을 양립한 다이싱 필름을 제조하기 위한 다이싱 필름 기재용 수지 조성물을 제공한다. 에틸렌·불포화 카르본산·불포화 카르본산 에스테르 공중합체의 아이오노머(A) 30질량부 이상 90질량부 이하와, 에틸렌계 공중합체(B) 10질량부 이상 70질량부 이하(단, 성분(A) 및 성분(B)의 합계를 100질량부로 한다)를 함유하며, JIS K7206-1999로 규정되는 비카트 연화점이 50℃ 미만인, 다이싱 필름 기재용 수지 조성물, 및 당해 수지 조성물을 이용한 다이싱 필름용 기재 및 다이싱 필름. The purpose of the present invention is to provide a resin composition for a dicing film substrate for producing a dicing film having both high strength and high thermal shrinkage. Provided are: a resin composition for a dicing film substrate, the resin composition containing 30-90 parts by mass of an ionomer (A) of an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer and 10-70 parts by mass of an ethylene copolymer (B) (with respect to 100 parts by mass in total of component (A) and component (B)), and having a Vicat softening point of less than 50°C as defined according to JIS K7206-1999; a dicing film substrate using the resin composition; and a dicing film using the resin composition.