3D BONDING PASSIVE DEVICES ON ACTIVE DEVICE DIES TO FORM 3D PACKAGES

Provided is a package which comprises: a package substrate; an interposer over and bonded to the package substrate; a first wafer over and bonding to the interposer; and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer...

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Bibliographic Details
Main Authors YU CHEN HUA, LIU CHUNG SHI, PAN KUO LUNG, TSAI HAO YI, LAI CHI HUI, CHUN SHU RONG, KUO TIN HAO
Format Patent
LanguageEnglish
Korean
Published 09.03.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a package which comprises: a package substrate; an interposer over and bonded to the package substrate; a first wafer over and bonding to the interposer; and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein. Therefore, efficiency of a power transmission network is improved. 패키지는, 패키지 기판, 상기 패키지 기판 위에 있으며 상기 패키지 기판에 본딩된 인터포저, 상기 인터포저 위에 있으며 상기 인터포저에 본딩한 제1 웨이퍼, 및 상기 제1 웨이퍼 위에 있으며 상기 제1 웨이퍼에 본딩한 제2 웨이퍼를 포함한다. 상기 제1 웨이퍼는 안에 독립적 수동 소자 다이들을 갖는다. 상기 제2 웨이퍼는 안에 능동 소자 다이들을 갖는다.
Bibliography:Application Number: KR20200066480