PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

• Main Authors: SHIN SEUNG YUL, RYU SUNG WUK
• Format: Patent
• Language: English; Korean
• Published: 08.03.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

According to an embodiment of the present invention, a printed circuit board includes: a first insulation layer; a second insulation layer disposed on the first insulation layer; and a cavity formed in the first and second insulation layers, wherein the cavity includes a first part formed in the second insulation layer and a second part formed in the first insulation layer, and the first part has a first cross-sectional shape and the second part has a second cross-sectional shape which is different from the first cross-sectional shape. According to the present invention, it is possible to reduce the thickness of the printed circuit board by providing a space in which a device can be mounted in an outermost insulating layer. 실시 예에 따른 인쇄회로기판은 제1 절연층; 상기 제1 절연층 상에 배치된 제2 절연층; 및 상기 제1 및 제2 절연층에 형성된 캐비티를 포함하고, 상기 캐비티는, 상기 제2 절연층에 형성된 제1 부분; 및 상기 제1 절연층에 형성된 제2 부분을 포함하고, 상기 제1 부분은, 제1 단면 형상을 가지고, 상기 제2 부분은, 상기 제1 단면 형상과 다른 제2 단면 형상을 가진다.