IMPRINTING METHOD IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD

• Main Authors: HATTORI TADASHI, AOKI AKIO
• Format: Patent
• Language: English; Korean
• Published: 03.03.2021
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Provided is an imprinting method capable of forming a pattern of an imprinting material on a substrate while more reliably preventing damage to an uneven pattern of a mold by a foreign material. The imprinting method forming the pattern of the imprinting material on the substrate using the mold comprises: a supply step supplying the imprinting material on the substrate; a pattern forming step of coming the imprinting material of a predetermined shot region on the substrate in contact with the uneven pattern of the mold and forming the pattern of the imprinting material after supplying the imprinting material; and a foreign material pressing step of pressing the foreign material by using a pressing surface of a pressing unit opposite to a surface of the substrate when a foreign material is present on the surface of the predetermined shot region of the substrate, wherein the foreign material pressing step is performed before the pattern forming step, and in the foreign material pressing step, the foreign material is pressed so that the amount of protrusion becomes smaller than the film thickness of the imprinting material after the pattern forming step. 이물에 의한 몰드의 요철 패턴의 손상을 더 확실하게 방지하면서 기판 상에 임프린트재의 패턴을 형성할 수 있는 임프린트 방법을 제공한다. 몰드를 사용해서 기판 상에 임프린트재의 패턴을 형성하는 임프린트 방법은, 기판 상에 임프린트재를 공급하는 공급 단계; 임프린트재를 공급한 후에, 기판 상의 미리결정된 샷 영역의 임프린트재와 몰드의 요철 패턴을 접촉시켜서 임프린트재의 패턴을 형성하는 패턴 형성 단계; 및 기판의 미리결정된 샷 영역의 표면에 이물이 존재하는 경우에, 기판의 표면에 대향하는 가압 유닛의 가압면을 사용하여 이물을 가압하는 이물 가압 단계를 포함하고, 이물 가압 단계는 패턴 형성 단계 전에 행해지며, 이물 가압 단계에서는 패턴 형성 단계 후의 임프린트재의 막 두께보다 돌출량이 작아지도록 이물이 가압된다.