땜납 입자 및 땜납 입자의 제조 방법
복수의 오목부를 갖는 기체와 땜납 미립자를 준비하는 준비 공정과, 상기 땜납 미립자의 적어도 일부를, 상기 오목부에 수용하는 수용 공정과, 상기 오목부에 수용된 상기 땜납 미립자를 융합시켜, 상기 오목부의 내부에 땜납 입자를 형성하는 융합 공정을 포함하고, 상기 땜납 입자의 평균 입자경이 1μm~30μm, 상기 땜납 입자의 C.V.값이 20% 이하인, 땜납 입자의 제조 방법. A method for producing solder particles, which includes: a preparation step wherein a ba...
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Main Authors | , , , , , |
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Format | Patent |
Language | Korean |
Published |
26.02.2021
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Abstract | 복수의 오목부를 갖는 기체와 땜납 미립자를 준비하는 준비 공정과, 상기 땜납 미립자의 적어도 일부를, 상기 오목부에 수용하는 수용 공정과, 상기 오목부에 수용된 상기 땜납 미립자를 융합시켜, 상기 오목부의 내부에 땜납 입자를 형성하는 융합 공정을 포함하고, 상기 땜납 입자의 평균 입자경이 1μm~30μm, 상기 땜납 입자의 C.V.값이 20% 이하인, 땜납 입자의 제조 방법.
A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 μm to 30 μm; and the C.V. value of the solder particles is 20% or less. |
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AbstractList | 복수의 오목부를 갖는 기체와 땜납 미립자를 준비하는 준비 공정과, 상기 땜납 미립자의 적어도 일부를, 상기 오목부에 수용하는 수용 공정과, 상기 오목부에 수용된 상기 땜납 미립자를 융합시켜, 상기 오목부의 내부에 땜납 입자를 형성하는 융합 공정을 포함하고, 상기 땜납 입자의 평균 입자경이 1μm~30μm, 상기 땜납 입자의 C.V.값이 20% 이하인, 땜납 입자의 제조 방법.
A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 μm to 30 μm; and the C.V. value of the solder particles is 20% or less. |
Author | AKAI KUNIHIKO MIYAJI MASAYUKI EJIRI YOSHINORI MORIYA TOSHIMITSU SUKATA SHINICHIROU OKADA YUUHEI |
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Snippet | 복수의 오목부를 갖는 기체와 땜납 미립자를 준비하는 준비 공정과, 상기 땜납 미립자의 적어도 일부를, 상기 오목부에 수용하는 수용 공정과, 상기 오목부에 수용된 상기 땜납 미립자를 융합시켜, 상기 오목부의 내부에 땜납 입자를 형성하는 융합 공정을 포함하고, 상기 땜납 입자의 평균... |
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SubjectTerms | ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER |
Title | 땜납 입자 및 땜납 입자의 제조 방법 |
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