땜납 입자 및 땜납 입자의 제조 방법

• Main Authors: MORIYA TOSHIMITSU, SUKATA SHINICHIROU, EJIRI YOSHINORI, OKADA YUUHEI, AKAI KUNIHIKO, MIYAJI MASAYUKI
• Format: Patent
• Language: Korean
• Published: 26.02.2021
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CASTING; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CONDUCTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MACHINE TOOLS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM; WORKING METALLIC POWDER

복수의 오목부를 갖는 기체와 땜납 미립자를 준비하는 준비 공정과, 상기 땜납 미립자의 적어도 일부를, 상기 오목부에 수용하는 수용 공정과, 상기 오목부에 수용된 상기 땜납 미립자를 융합시켜, 상기 오목부의 내부에 땜납 입자를 형성하는 융합 공정을 포함하고, 상기 땜납 입자의 평균 입자경이 1μm~30μm, 상기 땜납 입자의 C.V.값이 20% 이하인, 땜납 입자의 제조 방법. A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 μm to 30 μm; and the C.V. value of the solder particles is 20% or less.