원자 층 증착 프로세스에서 산화 변환

• Main Authors: VAN SCHRAVENDIJK BART JAN, AGNEW DOUGLAS WALTER, ABEL JOSEPH R
• Format: Patent
• Language: Korean
• Published: 15.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

기판을 프로세싱하기 위한 방법이 기술된다. 증기상의 제 1 반응 물질이 내부에 기판을 갖는 반응 챔버 내로 도입된다. 제 1 반응 물질은 기판 표면 상에 흡착되게 된다. 제 1 반응 물질의 비반응성 부분은 제 1 반응 물질의 플로우가 중단된 후 반응 챔버로부터 퍼지된다. 제 2 반응 물질은 제 1 반응 물질이 기판 표면 상에 흡착되는 동안 반응 챔버 내로 증기상으로 도입된다. 제 2 반응 물질은 1:1:1 비의 이수소 (dihydrogen)(H2), 질소-함유 반응 물질, 및 산소-함유 반응 물질을 포함한다. 플라즈마가 제 2 반응 물질에 기초하여 점화된다. 기판 표면은 플라즈마에 노출된다. 플라즈마가 소화된다. 반응 챔버로부터 가스가 퍼지된다. A method for processing a substrate is described. A first reactant in vapor phase is introduced into a reaction chamber having the substrate therein. The first reactant is allowed to be adsorb onto the substrate surface. The non-reactive portion of the first reactant is purged from the reaction chamber after a flow of the first reactant has ceased. The second reactant is introduced in vapor phase into the reaction chamber while the first reactant is adsorbed onto the substrate surface. The second reactant comprises a 1:1:1 ratio of dihydrogen (H2), a nitro-gen-containing reactant, and an oxygen-containing reactant. A plasma is ignited based on the second reactant. The substrate surface is exposed to the plasma. The plasma is extinguished. Gas from the reaction chamber is purged.