폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름

• Main Authors: SUENAGA SHUYA, SEKIGUCHI SHINJI, ABIKO YOHEI
• Format: Patent
• Language: Korean
• Published: 16.12.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

테트라카르본산이무수물에서 유래하는 구성단위A 및 디아민에서 유래하는 구성단위B를 갖는 폴리이미드 수지로서, 구성단위A가 하기 식(a-1)로 표시되는 화합물에서 유래하는 구성단위(A-1)와, 하기 식(a-2)로 표시되는 화합물에서 유래하는 구성단위(A-2)를 포함하고, 구성단위B가 하기 식(b-1)로 표시되는 화합물에서 유래하는 구성단위(B-1)를 포함하고, 구성단위A가 하기 식(a-x)로 표시되는 화합물에서 유래하는 구성단위(A-X)를 포함하지 않는, 폴리이미드 수지, 그리고 이 폴리이미드 수지를 포함하는 폴리이미드 바니시 및 폴리이미드 필름. The present invention provides a polyimide resin which comprises a constituent unit A that is derived from a tetracarboxylic acid dianhydride and a constituent unit B that is derived from a diamine, and which is configured such that: the constituent unit A contains a constituent unit (A-1) that is derived from a compound represented by formula (a-1) and a constituent unit (A-2) that is derived from a compound represented by formula (a-2); the constituent unit B contains a constituent unit (B-1) that is derived from a compound represented by formula (b-1); and the constituent unit A does not contain a constituent unit (A-X) that is derived from a compound represented by formula (a-x). The present invention also provides a polyimide varnish and a polyimide film, each of which contains this polyimide resin.