폴리이미드 수지, 폴리이미드 바니시 및 폴리이미드 필름

• Main Authors: SUENAGA SHUYA, SEKIGUCHI SHINJI, ABIKO YOHEI
• Format: Patent
• Language: Korean
• Published: 04.12.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

본 발명의 폴리이미드 수지는, 테트라카르본산이무수물에서 유래하는 구성단위A 및 디아민에서 유래하는 구성단위B를 갖는 폴리이미드 수지로서, 구성단위A가 식(a-1)로 표시되는 화합물에서 유래하는 구성단위(A-1)를 포함하고, 구성단위B가 식(b-1-1)로 표시되는 화합물에서 유래하는 구성단위(B-1-1), 식(b-1-2)로 표시되는 화합물에서 유래하는 구성단위(B-1-2), 및 식(b-1-3)으로 표시되는 화합물에서 유래하는 구성단위(B-1-3)로 이루어지는 군으로부터 선택되는 적어도 1개인 구성단위(B-1)를 포함하고, 수지 중에 시클로헥산환이 존재하지 않는다. This polyimide resin has a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein: the structural unit A includes a structural unit (A-1) derived from a compound represented by formula (a-1); the structural unit B includes a structural unit (B-1) which is at least one selected from the group consisting of a structural unit (B-1-1) derived from a compound represented by formula (b-1-1), a structural unit (B-1-2) derived from a compound represented by formula (b-1-2), and a structural unit (B-1-3) derived from a compound represented by formula (b-1-3); and no cyclohexane ring is present in the resin.