ZERO MASK HIGH DENSITY CAPACITOR

Provided are methods for eliminating use of additional masks, and semiconductor devices. A first interconnect layer is formed. A first resistive layer is formed on an upper portion of the first interconnect layer. A dielectric layer is formed on an upper portion of the first resistive layer. A secon...

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Bibliographic Details
Main Authors WU CHIA TIEN, HSIEH CHENG HSIANG, CHEN CHUNG HUI, CHEN WAN TE
Format Patent
LanguageEnglish
Korean
Published 03.12.2020
Subjects
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