ZERO MASK HIGH DENSITY CAPACITOR
Provided are methods for eliminating use of additional masks, and semiconductor devices. A first interconnect layer is formed. A first resistive layer is formed on an upper portion of the first interconnect layer. A dielectric layer is formed on an upper portion of the first resistive layer. A secon...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
03.12.2020
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Subjects | |
Online Access | Get full text |
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