LIGHT EMITTING DEVICE PACKAGE AND LIGHTING DEVICE

The light emitting device package includes: a light emitting device; a wavelength conversion layer including a phosphor on the light emitting device; an adhesive layer between the light emitting device and the wavelength conversion layer; a molding member surrounding the light emitting device, the a...

Full description

Saved in:
Bibliographic Details
Main Authors AN KWAN HO, CHO YUN MIN, YOON SUK BUM
Format Patent
LanguageEnglish
Korean
Published 02.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The light emitting device package includes: a light emitting device; a wavelength conversion layer including a phosphor on the light emitting device; an adhesive layer between the light emitting device and the wavelength conversion layer; a molding member surrounding the light emitting device, the adhesive layer and the wavelength conversion layer; and a reflective layer between the light emitting element and the molding member. The present invention provides the light emitting device package and the light source device, which are capable of improving reflectance. 발광소자패키지는 발광소자와, 발광소자 상에 형광체를 포함하는 파장변환층과, 발광소자와 파장변환층 사이에 접착층과, 발광소자, 접착층 및 파장변환층을 둘러싸는 몰딩부재와, 발광소자와 몰딩부재 사이에 반사층을 포함한다.
Bibliography:Application Number: KR20190059957