DEVICE FOR PROCESSING SUBSTRATE AND METHOD FOR CONTROLLING PROCEDURE OF ETCHING SUBSTRATE USING THE DEVICE

• Main Authors: CHUNG MENG TA, LIN CHIEN CHUNG, FENG CHUAN CHANG, LIN SHIH CHIA, HO TSUNG YU
• Format: Patent
• Language: English; Korean
• Published: 19.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

기판(6)을 처리하기 위한 장치(100)가 개시되며, 상기 기판(6)을 식각하는 절차 동안에 제어 모듈(4)은 스펙트럼 신호를 수신하고, 상기 스펙트럼 신호로부터 실시간 스펙트럼 데이터를 생성하며, 특성 데이터를 얻기 위해 상기 실시간 스펙트럼 데이터를 분석하고, 상기 특성 데이터에 기초하여 식각 종료점에 도달되는 시간을 결정한다. 또한, 상기 장치(100)를 이용하여 상기 기판(6)을 식각하는 절차를 제어하기 위한 방법이 개시된다. The invention discloses a treating fluid containing device. The treating fluid containing device comprises a tank body, a leakage-proof unit and a cold fluid conveying unit, wherein the tank body is used for accommodating a treating fluid; the leakage-proof unit is arranged on the upper side of the tank body. The cold liquid transmission unit is used for circulation of cooling liquid and comprisesa pipe body set, a first fixing end and a second fixing end, the pipe body set is arranged in the tank body, and the first fixing end and the second fixing end are arranged on the two sides of the pipe body set and connected with the leakage-proof unit. When the cooling liquid leaks from at least one of the first fixing end and the second fixing end, the cooling liquid flows to the leakage-proofunit.