저 헤이즈 폴리이미드 필름

• Main Authors: KOURTAKIS KOSTANTINOS, SCOTT PEGGY, ROSSI GENE M
• Format: Patent
• Language: Korean
• Published: 18.11.2020
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

제1 양태에서, 저 헤이즈 폴리이미드 필름은 이무수물, 디아민, 및 색-조정 화합물을 포함한다. 저 헤이즈 폴리이미드 필름은 두께가 1 내지 150 ㎛ 범위이고; 이무수물 및 디아민 조성이 동일하지만 색-조정 화합물이 없는 저 헤이즈 폴리이미드 필름과 비교할 때, a*가 0.2 초과의 |Δa*|로 0에 더 가깝고 b*가 0으로부터 최대 0.2 더 멀리 있거나, 또는 b*가 0.2 초과의 |Δb*|로 0에 더 가깝고 a*가 0으로부터 최대 0.2 더 멀리 있고; 헤이즈가 4% 미만이다. 제2 양태에서, 전자 장치는 제1 양태의 저 헤이즈 폴리이미드 필름을 포함한다. In a first aspect, a low haze polyimide film includes, a dianhydride, a diamine, and a color-tuning compound. The low haze polyimide film has a thickness in a range of from 1 to 150 um, an a* closer to zero with a |Δa*| greater than 0.2 and a b* that is at most 0.2 further away from zero, or a b* closer to zero with a |Δb*| greater than 0.2 and an a* that is at most 0.2 further away from zero, when compared to a low haze polyimide film of the same dianhydride and diamine composition, but without the color-tuning compound, and a haze of less than 4%. In a second aspect, an electronic device includes the low haze polyimide film of the first aspect.