STAGE FOR CUTTING A SUBSTRATE AND SUBSTRATE CUTTING DEVICE INCLUDING THE STAGE

• Main Authors: KIM JONGHYUP, HAN SANG SUN, LEE JINPYUNG, LIM JONG HEE
• Format: Patent
• Language: English; Korean
• Published: 29.10.2020
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; FREQUENCY-CHANGING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a substrate cutting stage and a substrate cutting apparatus including the same. The substrate cutting stage comprises: a first stage including the lower surface, the upper surface, and the side surface connecting the lower surface and the upper surface, overlapping a cut region of the substrate and defining a first through hole passing through the upper and lower surfaces, and exposed from the side surface and defining a first opening and a second opening which are connecting an external space and a space of the first through hole; and a second stage supporting the first stage and defining a second through hole overlapping the first through hole. An object of the present invention is to provide the substrate cutting stage capable of easily removing a removed portion and the substrate cutting apparatus including the same. 기판 절단용 스테이지는, 하면, 상면, 및 상기 하면과 상기 상면을 연결하는 측면을 포함하고, 기판의 절단 영역에 중첩하며 상기 상면 및 상기 하면을 관통하는 제1 관통홀, 및 상기 측면으로부터 노출되어 외부 공간과 상기 제1 관통홀의 공간을 연결하는 제1 개구부 및 제2 개구부가 정의된 제1 스테이지, 상기 제1 스테이지를 지지하고, 상기 제1 관통홀에 중첩한 제2 관통홀이 정의된 제2 스테이지를 포함한다.