열전도 시트 및 열전도 시트를 사용한 방열 장치

• Main Authors: YAJIMA MICHIAKI, KOBUNE MIKA
• Format: Patent
• Language: Korean
• Published: 21.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

열전도 시트는, 인편상 입자, 타원체상 입자 및 봉상 입자로 이루어지는 군에서 선택되는 적어도 1종의 흑연 입자(A)를 함유하고, 상기 인편상 입자의 경우에는 면방향, 상기 타원체상 입자의 경우에는 장축 방향, 상기 봉상 입자의 경우에는 장축 방향이, 두께 방향으로 배향되어 있으며, 150℃에 있어서의 압축 응력이 0.1 MPa일 때의 탄성률이 1.4 MPa 이하이며, 25℃에 있어서의 택력이 5.0 N·㎜ 이상이다. A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.