SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: TSUJIMOTO HIROSHI, TAKAHASHI TORU, YONEDA SHIGERU, SHINDO NOBUAKI
• Format: Patent
• Language: English; Korean
• Published: 07.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

The present invention is able to reduce particles generated when a substrate is adsorbed by an electrostatic chuck, in processing the substrate, and to improve a throughput of the substrate processing. According to the present invention, the substrate processing method comprises: a loading step of loading the substrate on the electrostatic chuck set to be at a predetermined temperature; a first adsorbing step of applying a first DC voltage to the electrostatic chuck so as to adsorb the substrate on the electrostatic chuck; a maintaining step of applying the first DC voltage to the electrostatic chuck and maintaining the adsorption of the substrate by the electrostatic chuck until the difference in temperature between the electrostatic chuck and the substrate becomes 30°C or lower; and a second adsorbing step of applying a second DC voltage which is higher than the first DC voltage to the electrostatic chuck so as to adsorb the substrate on the electrostatic chuck. 본 발명은, 기판 처리에 있어서 정전 척으로 기판을 흡착할 때의 파티클을 저감함과 함께, 당해 기판 처리의 스루풋을 향상시킨다. 기판을 처리하는 방법이며, 미리 정해진 온도로 설정된 정전 척 상에 상기 기판을 적재하는 적재 공정과, 제1 직류 전압을 상기 정전 척에 인가하여, 당해 정전 척 상에 상기 기판을 흡착하는 제1 흡착 공정과, 상기 제1 직류 전압을 상기 정전 척에 인가하면서, 상기 정전 척과 상기 기판의 온도 차가 30℃ 이하로 될 때까지, 상기 정전 척에 의한 상기 기판의 흡착을 유지하는 유지 공정과, 상기 제1 직류 전압보다 높은 제2 직류 전압을 상기 정전 척에 인가하여, 당해 정전 척 상에 상기 기판을 흡착하는 제2 흡착 공정을 갖는다.