MOLDING METHOD MOLDING APPARATUS IMPRINT METHOD METHOD FOR MANUFACTURING ARTICLE AND ARTICLE MANUFACTURING SYSTEM

• Main Authors: NARIOKA SHINTARO, NAKAYAMA TAKAHIRO
• Format: Patent
• Language: English; Korean
• Published: 07.10.2020
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

The present invention relates to an imprinting method in which a mold is brought into contact with an imprinting material disposed on a underlying layer on a substrate, and the imprinting material is cured to obtain a cured product to which a shape of the mold is transferred. In addition, the imprinting method includes the steps of: adjusting the position of the mold and the substrate while the mold and the underlying layer of the substrate are in contact with the imprinting material; measuring the in-plane distribution of shear force generated during the position adjustment; and determining application conditions of the underlying layer based on a measurement result. 임프린트 방법은, 기판 위의 하지층상에 배치된 임프린트 재료에 몰드를 접촉시키고 해당 임프린트 재료를 경화시켜서, 상기 몰드의 형상이 전사되는 경화물을 얻는다. 임프린트 방법은, 상기 몰드와 상기 기판의 하지층이 상기 임프린트 재료와 접촉한 상태로 상기 몰드와 상기 기판의 위치 조정을 행하는 스텝과, 상기 위치 조정시에 발생된 전단력의 면내 분포를 계측하는 스텝과, 상기 계측결과에 근거하여 상기 하지층의 도포 조건을 결정하는 스텝을 포함한다.