ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT PRODUCING METHOD THEREOF SEMICONDUCTOR DEVICE AND PRODUCING METHOD THEREOF

• Main Authors: KONDO TAKASHI, MITANI MUNEHISA, KATAYAMA HIROYUKI, EBE YUKI
• Format: Patent
• Language: English; Korean
• Published: 06.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is an encapsulating sheet-covered semiconductor element which can obtain a semiconductor device with a simple process. The encapsulating sheet-covered semiconductor element comprises: a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface; and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface which is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface. The exposed surface has the other side portion which is positioned toward the other side with respect to the one surface of the semiconductor element. 봉지 시트 피복 반도체 소자는, 기판에 접촉하는 한쪽면과, 한쪽면의 다른 쪽측에 배치되는 다른 쪽면을 갖는 반도체 소자와, 반도체 소자의 적어도 다른 쪽면을 피복하는 봉지 시트를 구비한다. 봉지 시트는, 한쪽측으로부터 다른 쪽측으로 투영했을 때에, 반도체 소자의 한쪽면에 포함되지 않고, 또한, 한쪽면으로부터 노출하는 노출면을 구비한다. 노출면은, 반도체 소자의 한쪽면보다 다른 쪽측에 위치하는 다른 쪽측 부분을 갖고 있다.