필름형 접착제 및 그 제조 방법과, 반도체 장치 및 그 제조 방법

• Main Authors: YAMAZAKI TOMOHARU, HASHIMOTO SHINTARO, MASUNO DAISUKE, NAKAMURA YUKI, KIKUCHI KENTA
• Format: Patent
• Language: Korean
• Published: 05.10.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

기판 상에 제1 와이어를 통해 제1 반도체 소자가 와이어 본딩 접속되며, 제1 반도체 소자 상에, 제2 반도체 소자가 압착되어 이루어지는 반도체 장치에 있어서, 제2 반도체 소자를 압착하며, 적어도 제1 와이어의 적어도 일부를 매립하기 위해 이용되는 필름형 접착제로서, 제1 접착 필름과, 제1 접착 필름 상에 적층된 제2 접착 필름을 구비하고, 필름형 접착제의 용제 함유율이 필름형 접착제 전량을 기준으로 하여 1.5 질량% 이하이며, 필름형 접착제의 80℃에 있어서의 전단 점도가 5000 ㎩·s 이하인, 필름형 접착제가 개시된다. Disclosed is a film-form adhesive which is used in a semiconductor device in which a first semiconductor element is connected by wire-bonding on a substrate via a first wire, and a second semiconductor element is attached by pressure to the first semiconductor element. The film-form adhesive is used to pressure-attach the second semiconductor element and embed at least part of at least the first wire. The film-form adhesive comprises a first adhesive film and a second adhesive film laminated onto the first adhesive film. The solvent-content of the film-form adhesive does not exceed 1.5% by mass with respect to the total quantity of film-form adhesive, and the shear viscosity of the film-form adhesive at 80°C does not exceed 5000 Pa·s.