ETCHANT COMPOSITION

An etching composition according to the present invention comprises nitric acid, an ammonium salt, and water while not containing phosphoric acid and phosphate, thereby having excellent selective etching ratio of a titanium nitride film. 본 발명에 따른 식각 조성물은 질산; 암모늄염; 및 물을 포함하되, 인산 및 인산염;을 포함하지 않는 것을 특징...

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Bibliographic Details
Main Authors KIM TAE HEE, YOO JAE SUNG, KIM HAN CHEOL, YANG JIN SEOK
Format Patent
LanguageEnglish
Korean
Published 16.09.2020
Subjects
ADHESIVES
CHEMISTRY
DYES
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
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Summary:An etching composition according to the present invention comprises nitric acid, an ammonium salt, and water while not containing phosphoric acid and phosphate, thereby having excellent selective etching ratio of a titanium nitride film. 본 발명에 따른 식각 조성물은 질산; 암모늄염; 및 물을 포함하되, 인산 및 인산염;을 포함하지 않는 것을 특징으로 한다.
Bibliography:Application Number: KR20190025763