Printed Circuit Board and manufacturing method for the same

A printed circuit board and a manufacturing method thereof are provided. According to an embodiment of the present invention, the printed circuit board includes: a flexible substrate part having a first flexible film layer having flexibility; and a rigid substrate part connected to the flexible subs...

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Bibliographic Details
Main Authors LEE YANGJE, JANG JUNGHOON, CHO KIEUN, PARK HYUN KYUNG
Format Patent
LanguageEnglish
Korean
Published 14.09.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board and a manufacturing method thereof are provided. According to an embodiment of the present invention, the printed circuit board includes: a flexible substrate part having a first flexible film layer having flexibility; and a rigid substrate part connected to the flexible substrate part and formed thicker than the flexible substrate part, wherein the rigid substrate part includes a plurality of metal layers exposed to the outside from the side surface facing the flexible substrate part, disposed on one surface of the flexible substrate part, spaced apart from each other, and formed in different layers. 인쇄회로기판 및 그 제조방법이 개시된다. 본 발명의 일 실시예에 따른 인쇄회로기판은, 굴곡성이 있는 제1 연성 필름층을 구비한 연성 기판부 및 연성 기판부와 연결되며 연성 기판부보다 두껍게 형성된 경성 기판부를 포함하고, 경성 기판부는 연성 기판부를 향하는 측면에서 외부로 노출되고 연성 기판부의 일면 위에 배치되며 서로 이격되어 높이가 다른 층에 형성된 복수의 금속층을 포함한다.
Bibliography:Application Number: KR20190024744