이형 필름

• Main Authors: SHOJI HIDEO, TANAKA TERUYA, MANABE ISAO
• Format: Patent
• Language: Korean
• Published: 25.08.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

[과제] 본 발명의 과제는 금형 추종성, 내열성이 우수하고, 또한 가열시에 생기는 주름을 억제하고, 대변형 후에도 이형성이 변화되기 어려운 특성을 가짐으로써, 공정 용도, 특히 반도체 밀봉 공정 용도에 적합하게 사용하는 것이 가능한 이형 필름을 제공하는 것에 있다. [해결수단] TMA에 의해 측정한 30℃부터 200℃까지 10℃/분으로 승온했을 때의 30℃∼150℃에 있어서의 최대 치수 변화율을 S1(%), S1을 부여하는 온도를 T1(℃), 40℃에 있어서의 치수 변화율을 S0(%)이라고 했을 때, 하기 (I), (II)식을 충족시키고, 25℃에 있어서의 표면 자유 에너지(Sa)(mN/㎜)와 180℃에서 3분간 열처리를 행한 후의 표면 자유 에너지(Sb)(mN/㎜)와 180℃에서 50% 신장 후의 표면 자유 에너지(Sc)(mN/㎜)가 필름의 적어도 편면에 있어서 하기 (III), (IV)식을 충족시키는 공정용 이형 필름. 0≤S1≤1.5...(I) 0≤|S1-S0|/(T1-40)≤0.050...(II) 0≤|Sa-Sb|≤15...(III) 0≤|Sa-Sc|≤15...(IV) A release film satisfies formulas (I) and (II) when S1 (%) represents the maximum dimensional change rate between 30° C. and 150° C. when the temperature is raised from 30° C. to 200° C. at a rate of 10° C./min, T1 (° C.) represents the temperature at which S1 is obtained, and S0 (%) represents the dimensional change rate at 40° C. The surfaces may have a surface free energy Sa (mN/mm) at 25° C., surface free energy Sb (mN/mm) after having been subjected to a heat treatment at 180° C. for 3 minutes, and surface free energy Sc (mN/mm) after having been stretched by 50% at 180° C. that satisfy formulas (III) and (IV).0≤S1≤1.5  Formula (I):0≤|S1−S0|/(T1−40)≤0.050  Formula (II):0≤|Sa−Sb|≤15  Formula (III):0≤|Sa−Sc|≤15  Formula (IV):