PASTE COMPOSITION FOR OUTER ELECTRODE OF INDUCTOR

• Main Authors: KIM SU HAN, CHUNG KWANG CHOON, LEE JI YEON
• Format: Patent
• Language: English; Korean
• Published: 21.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; INDUCTANCES; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MAGNETS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSFORMERS

The present invention relates to a paste composition for an outer electrode of an inductor, which includes one or more silver materials selected from a group consisting of silver nano-powder, spherical type silver, and flake type silver. According to the present invention, when a paste composition having a low curing time, a low resistance, and a short curing time is used, productivity can be increased by optimization of coating properties. Moreover, a peak shape removing process is not required to minimize loss of paste, thereby providing a paste saving effect. The thickness and the shape of an outer electrode can be maintained by one dipping process and an outer electrode with a small thickness can be also formed by an additional process. Due to application of nanoparticles, DC resistance (RDC) characteristics and reliability can be improved. Accordingly, the paste composition can be applied to a high performance and ultrasmall inductor product. The paste composition comprises a silver material, a binder, a curing agent, a thixotropic agent, a dispersant, and a solvent. 본 발명은 은 나노 분말(Ag nano powder), 구형 은(spherical type Ag) 및 판상형 은(flake type Ag)으로 구성된 군에서 선택된 하나 이상의 은 재료를 포함하는 인덕터의 외부전극용 페이스트 조성물에 관한 것으로, 본 발명에 따른 저온, 저저항 및 짧은 소성 시간을 갖는 페이스트 조성물을 이용하면, 코팅성 최적화에 따라 생산성을 향상시킬 수 있으며, 피크 형상 제거 공정이 필요없어 페이스트 손실을 최소화함으로써 페이스트 절감 효과를 얻을 수 있고, 1회 디핑(dipping) 공정으로 외부전극의 두께 및 형상을 유지할 수 있을 뿐만 아니라, 추가 공정으로 더 얇은 두께의 외부전극의 형성이 가능하며, 나노 입자의 적용으로 RDC(DC resistance) 특성 및 신뢰성을 개선할 수 있는바, 고성능 및 초소형 인덕터 제품에 적용이 가능하다.