PLATING APPARATUS AND METHOD FOR FABRICATING METAL FILM USING THE SAME
According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving productivity and reliability of a semiconductor panel or a printed circuit board. 본 발명의 기술적 사상에 따른 도금 장치는, 액상, 젤 타입, 또는 고체 타입의 도금 솔루션을 사용하여 금속 박막을...
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| Main Author | |
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| Format | Patent |
| Language | English Korean |
| Published |
24.07.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving productivity and reliability of a semiconductor panel or a printed circuit board.
본 발명의 기술적 사상에 따른 도금 장치는, 액상, 젤 타입, 또는 고체 타입의 도금 솔루션을 사용하여 금속 박막을 형성함으로써, 반도체 패널 또는 인쇄회로기판의 생산성 및 신뢰성을 향상시킬 수 있다. |
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| AbstractList | According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving productivity and reliability of a semiconductor panel or a printed circuit board.
본 발명의 기술적 사상에 따른 도금 장치는, 액상, 젤 타입, 또는 고체 타입의 도금 솔루션을 사용하여 금속 박막을 형성함으로써, 반도체 패널 또는 인쇄회로기판의 생산성 및 신뢰성을 향상시킬 수 있다. |
| Author | LEE JUNG WON |
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| DocumentTitleAlternate | 도금 장치 및 이를 이용한 금속 박막의 형성 방법 |
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| RelatedCompanies | NEPES CO., LTD |
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| Snippet | According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving... |
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| SubjectTerms | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| Title | PLATING APPARATUS AND METHOD FOR FABRICATING METAL FILM USING THE SAME |
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