PLATING APPARATUS AND METHOD FOR FABRICATING METAL FILM USING THE SAME

According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving productivity and reliability of a semiconductor panel or a printed circuit board. 본 발명의 기술적 사상에 따른 도금 장치는, 액상, 젤 타입, 또는 고체 타입의 도금 솔루션을 사용하여 금속 박막을...

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Bibliographic Details
Main Author LEE JUNG WON
Format Patent
LanguageEnglish
Korean
Published 24.07.2020
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:According to the present invention, a plating apparatus forms a metal thin film by using a liquid, gel or solid type plating solution, thereby improving productivity and reliability of a semiconductor panel or a printed circuit board. 본 발명의 기술적 사상에 따른 도금 장치는, 액상, 젤 타입, 또는 고체 타입의 도금 솔루션을 사용하여 금속 박막을 형성함으로써, 반도체 패널 또는 인쇄회로기판의 생산성 및 신뢰성을 향상시킬 수 있다.
Bibliography:Application Number: KR20190005859