적층용 폴리에틸렌 수지 조성물, 적층체 및 적층체의 제조 방법

• Main Authors: SAKAMOTO SHINJI, MASUMURA CHIAKI, UTO YUICHI
• Format: Patent
• Language: Korean
• Published: 23.07.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

본 발명은 기재 등과의 우수한 접착성을 갖고, 바람직하게는 찌르기 용이성 등의 개봉 용이성도 우수한 적층용 폴리에틸렌 수지 조성물에 관한 것으로, 보다 상세하게는, 이하의 (a-1) 내지 (a-4)의 특성을 갖는 에틸렌·프로필렌 공중합체 (A)를 함유하는 적층용 폴리에틸렌 수지 조성물 (C)에 관한 것이다. (a-1) 에틸렌 유래 구성 단위를 주성분으로서 80 내지 98mol％, 프로필렌 유래 구성 단위를 필수적인 부성분으로서 2 내지 20mol％ 포함하고, 에틸렌 및 프로필렌 이외의 제3 α-올레핀에서 유래되는 구성 단위를 부성분으로서 5mol％ 이하 포함하고 있어도 된다 (a-2) MFR이 0.1 내지 100g/10분 (a-3) 밀도가 0.88 내지 0.94g/㎤ (a-4) 비닐과 비닐리덴의 합계가 0.35개 이상 The present invention relates to a polyethylene resin composition for lamination having excellent adhesiveness to a substrate or the like, and preferably also excellent in easy-opening properties such as easy piercing properties, and more specifically, relates to a polyethylene resin composition (C) for lamination containing an ethylene/propylene copolymer (A) having the following properties (a-1) to (a-4).(a-1) A constituent unit derived from ethylene is contained 80 to 98 mol% as a main component, a constituent unit derived from propylene is contained 2 to 20 mol% as an essential sub-component, and a constituent unit derived from a third α-olefin other than ethylene and propylene may be contained 5 mol% or less as a sub-component.(a-2) MFR 0.1 to 100 g/10 min.(a-3) Density is 0.88 to 0.94 g/cm3.(a-4) Total of vinyl and vinylidene is 0.35 or more.