EPOXY RESIN EPOXY RESIN COMPOSITION AND CURED PRODUCT

Provided are a modified epoxy resin having excellent crystallinity, which is solid at room temperature, thus providing excellent handling properties, and exhibits low viscosity and excellent solvent solubility for molding; an epoxy resin composition using the modified epoxy resin; and a cured produc...

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Bibliographic Details
Main Authors OMURA MASAKI, HIROTA KEN
Format Patent
LanguageEnglish
Korean
Published 08.07.2020
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Summary:Provided are a modified epoxy resin having excellent crystallinity, which is solid at room temperature, thus providing excellent handling properties, and exhibits low viscosity and excellent solvent solubility for molding; an epoxy resin composition using the modified epoxy resin; and a cured product having excellent high-temperature conductivity, obtained therefrom. In particular, the epoxy resin is represented by general formula (1) wherein the sum of n=0 bodies is 90 wt% or less, and a compound of n=1 or more is 5-35 wt%. In chemical formula 1, G represents a glycidyl group, wherein a glycidyl ether group bound to a biphenyl ring is either a 4,4′ bond or a 2,2′ bond, and n represents an integer of 0-10. (과제) 상온에서 고형으로서의 취급성이 우수하고, 또한 성형시의 저점도성, 용제 용해성이 우수한 결정성의 변성 에폭시 수지, 및 이것을 사용한 에폭시 수지 조성물, 그리고 그것으로부터 얻어지는 고열 전도성이 우수한 경화물을 제공한다. (해결 수단) 하기 일반식 (1) 로 나타내는 에폭시 수지로서, n = 0 체의 합계가 90 wt% 이하이고, n = 1 체 이상의 화합물이 5 wt% ∼ 35 wt% 인 것을 특징으로 하는 에폭시 수지. [화학식 1](식 중, G 는 글리시딜기를 나타내고, 비페닐 고리에 결합하는 글리시딜에테르기는 4,4' 결합이거나 2,2' 결합이고, n 은 0 ∼ 10 의 수를 나타낸다.)
Bibliography:Application Number: KR20190175606