SEMICONDUCTOR PACKAGE

• Main Authors: KIM HAN, KWON SANG HYUN, LEE CHOON KEUN, KIM HYUNG KYU, KANG SEUNG ON, PARK SEONG CHAN
• Format: Patent
• Language: English; Korean
• Published: 06.07.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a semiconductor package comprising: a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface disposed on the opposite side of the active surface; a heat dissipating member disposed on the inactive surface of the semiconductor chip including a graphite; a sealing material covering at least a part of each of the semiconductor chip and the heat dissipating member; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein at least one side surface of the heat dissipating member is coplanar with a side surface of the semiconductor chip. Therefore, the present invention is to provide the semiconductor chip having the heat dissipating member with excellent heat dissipating characteristics. 본 개시는 접속패드가 배치된 활성면 및 상기 활성면의 반대측에 배치된 비활성면을 갖는 반도체 칩, 상기 반도체 칩의 비활성면 상에 배치되며 그라파이트를 포함하는 방열부재, 상기 반도체 칩 및 상기 방열부재 각각의 적어도 일부를 덮는 봉합재, 및 상기 반도체 칩의 활성면 상에 배치되며, 상기 접속패드와 전기적으로 연결된 재배선층을 포함하는 연결구조체를 포함하고, 상기 방열부재의 적어도 일 측면은 상기 반도체 칩의 측면과 공면을 이루는 반도체 패키지에 관한 것이다.