LED Heat Radiation and Adhesive Sheet for LED Package

• Main Authors: CHOI DONG IN, HAN DONG SEOK, KIM DONG JU
• Format: Patent
• Language: English; Korean
• Published: 29.06.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The present invention relates to a multi-layer heat-dissipating adhesive sheet used in a heat generating element and, more specifically, to a multi-layer heat-dissipating adhesive sheet comprising: a core layer comprising an acrylic resin and expandable graphite; and two skin layers including an acrylic adhesive resin and an inorganic heat dissipation filler, and forming the outermost layer on both sides of the core layer. The heat-dissipating adhesive sheet is suitable for use in high-capacity electronic devices. 발열성 소자에 사용되는 다층 방열 점착 시트로서, 발열성 소자에 사용되는 다층 방열 점착 시트로서, 아크릴계 수지 및 익스팬더블 그라파이트(Expandable Graphite)를 포함하는 코어층, 아크릴계 점착 수지 및 무기 방열 필러를 포함하며, 코어층의 양면에서 최외층을 이루는 두 개의 스킨층을 포함하는 다층 방열 점착 시트를 제공한다.