Substrate treating apparatus

According to an embodiment of the present disclosure, a substrate processing apparatus comprises: a spin chuck for mounting a substrate and rotating the substrate; a chemical solution nozzle for providing a chemical solution on a surface of the substrate; a first laser device emitting first laser li...

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Bibliographic Details
Main Authors LEE SEUNG HO, KO YONG SUN, SHIM WOO GWAN, CHOI BO WO, PARK SANG JINE
Format Patent
LanguageEnglish
Korean
Published 26.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:According to an embodiment of the present disclosure, a substrate processing apparatus comprises: a spin chuck for mounting a substrate and rotating the substrate; a chemical solution nozzle for providing a chemical solution on a surface of the substrate; a first laser device emitting first laser light for heating the substrate and the chemical solution; and a second laser device emitting second laser light for etching an edge of the substrate. According to a technical embodiment of the present disclosure, the substrate processing apparatus may quickly etch at least one among a front portion, a rear portion, and a side portion of the edge of the substrate. 본 개시의 일 실시예에 따른 기판 처리 장치는 기판을 안착시키고, 상기 기판을 회전시키는 스핀 척; 상기 기판의 표면 상에 화학 약액을 제공하는 약액 노즐; 상기 기판 및 상기 화학 약액을 가열시키기 위한 제1 레이저 광을 출사하는 제1 레이저 장치; 및 상기 기판의 가장자리를 식각하기 위한 제2 레이저 광을 출사하는 제2 레이저 장치;를 포함하는 것을 특징으로 할 수 있다.
Bibliography:Application Number: KR20180164311