HEAT RELEASING SHEET AND THE MANUFACTURING METHOD THEREOF

According to an embodiment of the present invention, provided is a heat dissipation sheet with improved thermal conductivity and hardness in the thickness direction. According to the present invention, the heat dissipation sheet has a ratio of the thermal conductivity in the thickness direction to t...

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Bibliographic Details
Main Authors SEO JUNG DOO, KIM SEONG DONG, BAEK JONGGAB
Format Patent
LanguageEnglish
Korean
Published 11.06.2020
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:According to an embodiment of the present invention, provided is a heat dissipation sheet with improved thermal conductivity and hardness in the thickness direction. According to the present invention, the heat dissipation sheet has a ratio of the thermal conductivity in the thickness direction to the thermal conductivity in the plane direction of 5 or more, and the thermal conductivity in the thickness direction versus the thermal conductivity in the plane direction is 5 to 2,000 : 1. 구현예는 두께 방향의 열전도도 및 경도가 향상된 방열 시트에 관한 것이다.
Bibliography:Application Number: KR20180153424