Polypropylene resin composition with excellent stress-whitening resistance process for preparing the same and article molded therefrom

• Main Authors: CHUN YONGSUNG, KIM BONGSEOCK, LIM SEUNGHOON
• Format: Patent
• Language: English; Korean
• Published: 25.05.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to a polypropylene resin composition, a method for manufacturing the same, and a molded article manufactured therefrom. Particularly, the present invention relates to a polypropylene resin composition comprising an ethylene-propylene block copolymer resin and having excellent stress-whitening resistance, transparency and impact resistance. The polypropylene resin composition according to the present invention can be effectively used for a heat-adhesive layer film of a pouch for food packaging, which may have a poor appearance when folded, or a film for packaging a battery, which may undergo stress-whitening due to deformation during post-processing. 본 발명은 폴리프로필렌 수지 조성물, 그 제조방법 및 그로부터 제조된 성형품에 관한 것이다. 상세하게는, 본 발명은 에틸렌-프로필렌 블록 공중합체 수지를 포함하며, 내백화성, 투명성 및 내충격성이 우수한 폴리프로필렌 수지 조성물에 관한 것이다. 본 발명에 따른 폴리프로필렌 수지 조성물은 접혔을 때 외관이 불량해 보일 수 있는 식품 포장용 파우치의 열접착층 필름 또는 후가공 시 변형에 따른 백화가 발생할 수 있는 전지의 포장용 필름 등에 효과적으로 사용될 수 있다.