실리카함유 절연성 조성물

• Main Authors: SUGISAWA MASATOSHI, SUEMURA NAOHIKO
• Format: Patent
• Language: Korean
• Published: 13.05.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOUNDS THEREOF; CONDUCTORS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INORGANIC CHEMISTRY; INSULATORS; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

[과제] 실리카입자와 수지와 경화제를 포함하고, 실리카입자로부터의 Na이온의 용출을 억제·저감하고, 절연성의 경시변화가 적은 절연성 조성물을 제공한다. [해결수단] 실리카입자(A)와 수지(B)와 경화제(C)를 포함하는 절연성 조성물로서, 상기 실리카입자(A)는, SiO농도 3.8질량%의 이 수용액을 121℃, 20시간 가열했을 때의 용출Na이온량이 40ppm/SiO이하인 실리카입자이다. 실리카입자(A)는 특히 가열 후의 용출Na이온량이 5~38ppm/SiO인 실리카입자이며, 또한, 다가금속산화물의 다가금속M을 M/Si몰비로서 0.001~0.02의 비율로 포함하고, 입자 중의 NaO/SiO질량비가 700~1300ppm인 실리카입자로서, 상기 입자표면에, NaO/SiO질량비가 10~400ppm인 0.1~1.5nm의 층이 형성된, 5~40nm의 평균입자경을 갖는 실리카입자이다. There is provided an insulating composition containing silica particles, a resin, and a curing agent, wherein elution of Na ions from the silica particles is prevented or reduced, and the composition undergoes a small change in insulating property over time.An insulating composition comprising silica particles (A), a resin (B), and a curing agent (C), wherein: when an aqueous solution of the silica particles (A) having an SiO2concentration of 3.8% by mass is heated at 121°C for 20 hours, the amount of Na ions eluted from the silica particles (A) is 40 ppm/SiO2or less,Especially, wherein the amount of Na ions eluted from the silica particles (A) after the heating may be 5 to 38 ppm/SiO2, and further, the silica particles (A) may contain a polyvalent metal oxide such that the ratio by mole of a polyvalent metal M to Si is 0.001 to 0.02; the mass ratio of Na2O/SiO2in the silica particles may be 700 to 1,300 ppm; and the silica particles may have, on the surfaces thereof, a layer having a thickness of 0.1 to 1.5 nm and an Na2O/SiO2mass ratio of 10 to 400 ppm, and may have an average particle diameter of 5 to 40 nm.