Semiconductor device and method of fabricating the same

The present invention provides a semiconductor package and a method for manufacturing the same. According to embodiments, a semiconductor element comprises: a semiconductor substrate having a conductive pad on one surface; a pillar pattern provided on the conductive pad; a solder seed pattern provid...

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Bibliographic Details
Main Authors LEE INYOUNG, JANG DONGHYEON, BAE JINKUK, CHUNG HYUNSOO
Format Patent
LanguageEnglish
Korean
Published 08.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a semiconductor package and a method for manufacturing the same. According to embodiments, a semiconductor element comprises: a semiconductor substrate having a conductive pad on one surface; a pillar pattern provided on the conductive pad; a solder seed pattern provided on an upper surface of the pillar pattern; and a solder part provided on the pillar pattern and the solder seed pattern. A width of the solder seed pattern may be smaller than a width of the upper surface of the pillar pattern. According to the present invention, electric properties and mechanical properties of a connection terminal can be improved. 본 발명은 반도체 패키지 및 그 제조 방법이 제공된다. 실시예들에 따르면, 반도체 소자는 일면 상에 도전 패드를 갖는 반도체 기판; 상기 도전 패드 상에 제공된 필라 패턴; 상기 필라 패턴의 상면 상에 제공된 솔더 씨드 패턴; 및 상기 필라 패턴 및 상기 솔더 씨드 패턴 상에 제공된 솔더부를 포함할 수 있다. 상기 솔더 씨드 패턴의 너비는 상기 필라 패턴의 상기 상면의 너비보다 더 작을 수 있다.
Bibliography:Application Number: KR20180115972