RESIN FILM COVERLAY FILM CIRCUIT BOARD COPPER FOIL WITH RESIN METAL-CLAD LAMINATE MULTILAYER CIRCUIT BOARD POLYIMIDE AND ADHESIVE RESIN COMPOSITION

• Main Authors: YAMADA HIROAKI, SUTO YOSHIKI
• Format: Patent
• Language: English; Korean
• Published: 07.04.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

Provided are a resin film and a polyimide which have improved dielectric characteristics and thus are suitable for electronic devices adapted for increasingly higher frequencies, while humidity dependency is suppressed. The resin film comprises a tetracarboxylic acid anhydrous component, and a polyimide obtained by reacting a diamine component as a resin component; wherein the diamine component, with respect to the total diamine components, contains 40 mol% or more of a dimer diamine composition having a dimer diamine as a main component, wherein a dielectric index E_1, as calculated from ###AAA###, which represents dielectric characteristics at 10 GHz after 24h drying under constant temperature and constant humidity conditions at 50%RH, is 0.010 or less; and a dielectric index E_2, as calculated from ###BBB###, represents dielectric characteristics at 10 GHz after 24h absorption at 23°C, wherein the ratio of E_1 to E_2 (E_2/E_1) is in the range of 3.0 to 1.0. [과제] 유전 특성의 개선에 의해 전자 기기의 고주파화에 대한 대응을 가능하게 하면서, 습도 의존성이 억제된 유전 특성을 갖는 수지 필름 및 폴리이미드를 제공한다. [해결수단] 수지 필름은, 테트라카르복실산 무수물 성분과, 디아민 성분을 반응시켜 이루어지는 폴리이미드를 수지 성분으로서 함유하고, 상기 디아민 성분이 전체 디아민 성분에 대해, 다이머디아민을 주성분으로 하는 다이머디아민 조성물을 40몰% 이상 함유함과 함께,에 기초하여 산출되는, 23℃, 50%RH의 항온항습 조건 하 24시간 조습 후의 10㎓에 있어서의 유전 특성을 나타내는 지표인 E값이 0.010 이하이고,에 기초하여 산출되는, 23℃, 24시간 흡수 후의 10㎓에 있어서의 유전 특성을 나타내는 지표인 E값에 있어서, E값에 대한 E값의 비(E/E)가 3.0 내지 1.0의 범위 내이다.