TARGET FOR SPUTTERING DEVICE COMPRISING COMPRESSED SHAPE OF SCORIA PARTICLE MATERIAL AND METHOD THEREOF

• Main Authors: HYUN SEUNG HO, SONG SANG JUN, KIM, HAK KYUN, SO, MOON SOOK
• Format: Patent
• Language: English; Korean
• Published: 01.04.2020
• Subjects: ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CEMENTS; CERAMICS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LIME, MAGNESIA; METALLURGY; REFRACTORIES; SLAG; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF NATURAL STONE

The present invention relates to a target for a sputtering apparatus comprising a compression molded article of a scoria particle material, and a manufacturing method thereof. In addition, the present invention relates to a sputtering apparatus equipped with the target for a sputtering apparatus, and a product in which the scoria particle material is deposited using the sputtering apparatus. The target for the sputtering apparatus of the scoria particle material is formed by inserting the scoria particle material into a mold and compressing the scoria particle material inserted in the mold under vacuum or normal pressure to a predetermined pressure. 본 발명은 스코리아(scoria) 입자 물질의 압축 성형물을 포함하는 스퍼터링 장치용 타겟 및 그 제조방법에 관한 것이다. 또한, 본 발명은 상기 스프터링 장치용 타겟이 구비된 스퍼터링 장치와, 이를 이용하여 스코리아 입자 물질을 증착시킨 제품에 관한 것이다.