Heat dissipation module

According to an embodiment of the present invention, a heat dissipation plate module comprises: a heat sink having a coolant flow path which communicates with a coolant inlet and a coolant outlet; an inlet pipe which communicates with the coolant inlet; an outlet pipe which communicates with the coo...

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Bibliographic Details
Main Authors MINWOO JEONG, BONGJUN KIM, HYOSEOK LEE, SEHYEON KIM
Format Patent
LanguageEnglish
Korean
Published 06.03.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to an embodiment of the present invention, a heat dissipation plate module comprises: a heat sink having a coolant flow path which communicates with a coolant inlet and a coolant outlet; an inlet pipe which communicates with the coolant inlet; an outlet pipe which communicates with the coolant outlet; and a porous member spaced apart from each of the coolant inlet and the coolant outlet, and coming in contact with the inner surface of the heat sink. Therefore, a heat transfer area can be maximized while pressure loss is minimized, and heat dissipation performance of a cooling target can be improved. 본 실시예는 쿨런트 입구 및 쿨런트 출구와 연통되는 쿨런트유로가 형성된 방열판과; 쿨런트 입구와 연통된 인렛 파이프와; 쿨런트 출구에 연통된 아웃렛 파이프와; 쿨런트 입구 및 쿨런트 출구 각각과 이격되며 방열판의 내면에 접촉된 다공부재를 포함하여, 압력손실은 최소화하면서 전열 면적을 최대화할 수 있고, 냉각대상의 방열 성능을 높일 수 있다.
Bibliography:Application Number: KR20180100488