HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

• Main Authors: KUSHIHARA NAOYUKI, KAWAMURA NORIFUMI, KUDO YUKI, TSUTSUMI YOSHIHIRO, HAMAMOTO YOSHIHIRA
• Format: Patent
• Language: English; Korean
• Published: 19.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

An object of the present invention is to provide: a resin composition providing a cured product which has excellent moldability, low elastic modulus at high temperatures, no drop in glass transition temperature, and good reflow resistance and heat resistance; and a semiconductor device sealed with the cured product. A thermosetting resin composition for semiconductor encapsulation comprises following components: (A) an epoxy resin which is solid at 25°C; (B) an organopolysiloxane having at least one cyclic imide group and at least one siloxane bond in one molecule; (C) an inorganic filler; (D) an anionic curing accelerator. [과제] 성형성이 우수하고, 고온에서도 저탄성율이며 유리 전이 온도의 저하도 없으며 또한 내리플로우성 및 내열성이 양호한 경화물을 부여하는 수지 조성물 및 해당 경화물로 밀봉된 반도체 장치의 제공. [해결 수단] 하기 성분 (A), (B), (C) 및 (D)를 포함하는 반도체 밀봉용 열경화성 수지 조성물. (A) 25℃에서 고체인 에폭시 수지 (B) 1 분자 중에 적어도 1개의 환상 이미드기와 적어도 1개의 실록산 결합을 갖는 오르가노폴리실록산 (C) 무기 충전재 (D) 음이온계 경화 촉진제