HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

• Main Authors: KUSHIHARA NAOYUKI, KAWAMURA NORIFUMI, KUDO YUKI, TSUTSUMI YOSHIHIRO
• Format: Patent
• Language: English; Korean
• Published: 19.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A purpose of the present invention is to provide: a thermosetting resin composition for semiconductor encapsulation which produces a cured product having excellent tracking resistance and dielectric properties, and having good continuous moldability; and a semiconductor device encapsulated with the...